BIS[BIS(TRIMETHYLSILYL)AMINO]TIN II 双[双(三甲基甲硅烷基)氨基]锡(II)

CAS 59863-13-7 MFCD00191794

化学结构图

59863-13-7
SMILES: C[Si](C)(C)N([Sn]N([Si](C)(C)C)[Si](C)(C)C)[Si](C)(C)C

化学属性

Mol. Formula[[(CH3)3Si]2N]2Sn
Mol. Weight439
Refractive indexn20/D 1.514(lit.)
Boiling Point112 °C/0.05 mmHg(lit.)
Density1.136 g/mL at 25 °C(lit.)
Melting Point37-38 °C(lit.)

别名和识别编码

Chemical NameBis[bis(trimethylsilyl)amino]tin(II)
CAS Number59863-13-7
PubChem Substance ID24865662
MDL NumberMFCD00191794
Chemical Name Translation双[双(三甲基甲硅烷基)氨基]锡(II)
Synonym 双[双(三甲基甲硅烷基)氨基]锡(II)
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分类

  • {SNA} CVD and ALD Precursors by Metal, Micro/NanoElectronics, Tin, Vapor Deposition Precursors, 材料科学
  • {SNA} CVD and ALD Precursors by Metal, Materials Science, Micro/NanoElectronics, Tin, Vapor Deposition Precursors
  • CVD and ALD Precursors by Metal, Materials Science, Micro/NanoElectronics, Tin, Vapor Deposition Precursors

相关文献及参考

  • 1. Synlett , 131, (1993)
  • 2. J. Org. Chem. 57 , 5063, (1992)
  • FT-IR 2 (3), 4397:B / Structure Index 1 , 472:A:5

安全信息

GHS Symbol
WGK Germany3
Hazard Codes Xi
Hazard statements
  • H228 Flammable solid 易燃固体
  • H315 Causes skin irritation 会刺激皮肤
  • H319 Causes serious eye irritation 严重刺激眼睛
  • H335 May cause respiratory irritation 可能导致呼吸道刺激
Personal Protective Equipment dust mask type N95 (US), Eyeshields, Gloves
Precautionary statements
  • P210 Keep away from heat/sparks/open flames/hot surfaces. — No smoking. 远离热源/火花/明火/热的表面。——禁止吸烟。
  • P261 Avoid breathing dust/fume/gas/mist/vapours/spray. 避免吸入粉尘/烟/气体/烟雾/蒸汽/喷雾。
  • P305+P351+P338
Signal word Warning
Safety Statements
  • S26 In case of contact with eyes, rinse immediately with plenty of water and seek medical advice 眼睛接触后，立即用大量水冲洗并征求医生意见；
  • S36 Wear suitable protective clothing 穿戴适当的防护服；
Risk Statements
  • R36/37/38 Irritating to eyes, respiratory system and skin 对眼睛、呼吸系统和皮肤有刺激性

系列性分类

  1. Materials Science 材料科学
  2. Micro/NanoElectronics - Materials Science
  3. Vapor Deposition Precursors - Micro/NanoElectronics
  4. CVD and ALD Precursors by Metal - Vapor Deposition Precursors
  5. Tin - CVD and ALD Precursors by Metal

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