锡电镀液, 金属含量≈82.2g/l 锡电镀液, 金属含量≈82.2g/l

CAS N/A MFCD00011238

化学结构图

N/A
SMILES: [SnH2]

化学属性

Mol. FormulaH2Sn
Mol. Weight120.726
TSCAYes

别名和识别编码

Chemical NameTIN PLATING SOLUTION
MDL NumberMFCD00011238
Chemical Name Translation锡电镀液, 金属含量≈82.2g/l

安全信息

Safety Statements
  • S36/37/39 Wear suitable protective clothing, gloves and eye/face protection 穿戴适当的防护服、手套和眼睛/面保护；
  • S45 In case of accident or if you feel unwell seek medical advice immediately (show the label where possible) 发生事故时或感觉不适时，立即求医（可能时出示标签）；
  • S26 In case of contact with eyes, rinse immediately with plenty of water and seek medical advice 眼睛接触后，立即用大量水冲洗并征求医生意见；
  • S20 When using do not eat or drink 使用时，不得进食，饮水；
Packing GroupIII
UN Number UN1760
Risk Statements
  • R34 Causes burns 会导致灼伤
  • R22 Harmful if swallowed 吞咽有害

系列性分类

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